发明名称 AUTOMATIC PLANT FOR PLASMA CUTTING
摘要 PURPOSE: An automatic plasma cutting facility is provided to automatically perform plasma cutting processes and to reduce processing time. CONSTITUTION: An automatic plasma cutting facility comprises a loading device(100), a first transfer device(200), an aligner(300), a second transfer device(400), a cutting device(500) and a central control device(600). The first transfer device transfers the cutting object to one end. The aligner is installed in one end of the first transfer device. The aligner pressurizes the cutting object and measures the length of the cutting object. The second transfer device grips the arranged cutting object in the aligner and transfers to a facility for processing.
申请公布号 KR20110003287(A) 申请公布日期 2011.01.11
申请号 KR20100065606 申请日期 2010.07.07
申请人 ENPLA TECHNOLOGIES, INC. 发明人 JUNG, JAE MIN;LEE, SUNG JIN;LEE, SUNG HO
分类号 B23K10/00;B23K37/04 主分类号 B23K10/00
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