| 摘要 |
PURPOSE: The manufacturing method of the printed circuit board for the memory card obtains the improvement of the reliability and cost down by omitting the etch back process. CONSTITUTION: The capping pattern(150) exposes the metal layer(120) located in the plating area of the outer connector(130) to outside. The metal layer is formed in order to protect the cut surface of the outer connector exposing with the cutting process. The capping pattern is expanded as the side cross section of the outer connector, and the upper side and lower-part in order to cover a part of the metal layer.
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