| 摘要 |
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to prevent the defect of a conductive wire by performing a test using a probe unit. CONSTITUTION: A semiconductor chip includes a circuit and a bonding pad electrically connected to the circuit. A re-wiring(120) is electrically connected to the bonding pad and includes a first pad unit and a second pad unit. An insulation unit(130) is arranged on the semiconductor chip, covers the bonding pad, and includes openings exposing the first pad unit and the second pad unit. |
