| 摘要 |
PURPOSE: A guard ring apparatus is provided to improve the reliability by protecting the semiconductor device from the noise or ESD which might occur during the process. CONSTITUTION: A plurality of metal layers(101, 102, 103) is laminated on a semiconductor substrate(100) with an interlayer insulation layer. A contact(110) between a semiconductor substrate and a metal layer connects the lowest metal layer of the plurality of metal layers and the semiconductor substrate.
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