| 摘要 |
PURPOSE: A susceptor, and a film forming apparatus, and a depositing method thereof are provided to implement the uniform temperature distribution of a wafer while reducing the adhesion, metal contamination, and position alignment defect of a wafer. CONSTITUTION: A gap(201) is formed between a silicon wafer(101) and a second susceptor unit(102b). The second susceptor unit comprises a concave part on a portion corresponding to the first susceptor unit(102a). A susceptor(102) has a gap(202) between the first susceptor unit and the second susceptor unit.
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