发明名称 EPITAXIAL WAFER FOR LIGHT EMITTING DIODE, AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an epitaxial wafer for light emitting diode, capable of enhancing efficiency of light emission, suppressing the deterioration of film quality in a current dispersion layer of the epitaxial wafer, and dispersing a current all over the chip.SOLUTION: The epitaxial wafer for AlGaInP system semiconductor light emitting diode has at least an n-type cladding layer, an active layer, and a p-type cladding layer composed of AlGaInP system material, an intermediate layer, and a p-type GaP current dispersion layer formed on an n-type single crystal substrate, wherein the p-type cladding layer is composed of a lower p-type cladding layer having a lattice constant roughly same as that of the n-type single crystal substrate and an upper p-type cladding layer having the lattice constant larger than that of the lower p-type cladding layer.
申请公布号 JP2011003751(A) 申请公布日期 2011.01.06
申请号 JP20090145969 申请日期 2009.06.19
申请人 HITACHI CABLE LTD 发明人 TOMIOKA HIROYUKI
分类号 H01L33/30 主分类号 H01L33/30
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