SUITABLE MULTILAYER HEAT CONDUCTIVE INTERMEDIATE STRUCTURE, AND MEMORY MODULE EQUIPPED WITH THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a heat conductive intermediate structure suitable for utilization when radiating heat from one or a plurality of components mounted to memory modules or other devices.SOLUTION: A heat transfer intermediate material is arranged on or along one surface of a flexible heat conductive sheet, or the flexible heat conductive sheet is jointed to a first layer and a second layer of the heat transfer intermediate material enclosed therein, or interposed therebetween. The flexible heat conductive sheet may be a flexible porous graphite sheet. The heat transfer intermediate material may be a heat conductive polymer. Polymer-polymer bonding easily occurs by forming holes in the graphite sheet. The polymer-polymer bonding can promote the mechanical joint of the first layer and the second layer to the graphite sheet and promote the provision of heat conduction between the first layer and the second layer.