发明名称 METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer substrate that improves adhesion with plating by making the surface of an insulating layer porous.SOLUTION: The method for manufacturing a multilayer substrate is configured to arrange an insulating layer on a substrate and to form a conductor layer on the insulating layer by plating. A pore forming agent is contained in an insulating material to be imparted on the substrate in order to form the insulating layer. The surface of the insulating layer is made porous by the pore forming agent so as to roughen the surface when forming the insulating layer by heating the insulating-layer material. Then, a conductor layer is formed on the insulating layer by plating.
申请公布号 JP2011003567(A) 申请公布日期 2011.01.06
申请号 JP20090142908 申请日期 2009.06.16
申请人 TOKAI DENSHI KOGYO KK;EN PURADO:KK 发明人 MATSUO KOZO;MATSUO TADASHI;TAKAMI SACHI;NAKANO TSUNETOMO;ISHIKAWA SEIJI
分类号 H05K3/18;H05K3/46 主分类号 H05K3/18
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