| 摘要 |
PROBLEM TO BE SOLVED: To provide a pattern inspection device capable of automatically detecting a pattern having a flaw difficult to visually discriminate in an SEM image, and to provide a pattern inspection method.SOLUTION: The pattern inspection device is equipped with an irradiation means for irradiating the surface of a sample with an electron beam; an electron detection means for detecting the amount of electrons produced from the surface of the sample, which has the pattern formed thereto, by the irradiation with the electron beam; an image processing means for forming the SEM image of the pattern on the basis of the amount of the electrons; and a control means for acquiring the flaw position data of the pattern formed on the sample from an optical flaw inspection device. The control means specifies a flaw candidate pattern from the SEM image, on the basis of the flaw position data and determines whether the flaw of the flaw candidate pattern is transferred to a wafer. The control part determines the field of vision of the SEM image, on the basis of a flaw position and specifies the flaw candidate pattern from the image data of the pattern displayed on the SEM image within the field of vision. |
