| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing an electronic component capable of reducing the possibility that a connector to be inserted into an opening formed in the wall of a substrate is damaged, and to provide an electronic device.SOLUTION: The package for housing the electronic component includes a base 3 having a cavity C in which an electronic component 2 is housed, an opening H formed in the wall 3b of the substrate 3 to communicate with the cavity C, and the connector 4 which is inserted into the opening H and electrically connected with the electronic component 2. The wall 3b has a first wall 31b in which the opening H is formed, and a second wall 32b in which the opening H is not formed. In the plan view, the first wall 31b has a width Lwhich is wider than the width Lof the second wall 32b, and the end Pof the first wall 31b is located substantially at the same position as that of the end Pof the connector 4 in the vertical direction, or located on the outside of the end Pof the connector 4 in the vertical direction. |
