| 摘要 |
PROBLEM TO BE SOLVED: To provide a temperature sensor for wafer chuck having a withstand voltage characteristic of about 10 kV and readily enabling attachment/removal operation to/from a wafer chuck to be carried out.SOLUTION: The temperature sensor for wafer chuck 10 is attached, such that a fixing block 13 which has a first through-hole 13A corresponding to the insertion hole 21B of a chuck top 21 of the wafer chuck 20, is connected to the side face of the chuck top 21 through a first screw member 15, and the temperature sensor 10 is screwed to the fixing block 13 through an attaching member 14, which is disposed at the base section of a temperature sensing element 11 to be inserted into the insertion hole 21B of the chuck top 21 from the first through-hole 13A. |
