| 摘要 |
A semiconductor memory device includes: a repair node; a fuse one side of which is coupled to the repair node; a pull-down unit configured to selectively transfer a ground voltage to the repair node; a pull-up unit configured to selectively transfer a driving voltage to another side of the fuse; and a voltage drop unit coupled between the pull-up unit and the fuse and configured to lower a voltage level of the driving voltage.
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