| 摘要 |
<p>Provided is a printed circuit board having a lower electrical resistance, and which is characterized in consisting of a first insulation layer; a first conductor circuit formed on the above-mentioned first insulation layer; a second insulation layer formed on the above-mentioned first insulation layer and the above-mentioned first conductor circuit, and which has an opening section that reaches the above-mentioned first conductor circuit; a second conductor circuit formed on the above-mentioned second insulation layer; and a via conductor that is formed within the above-mentioned opening section, and that connects the above-mentioned first conductor circuit and the above-mentioned second conductor circuit. The printed circuit board is also characterized in having the above-mentioned via conductor provided with a seed layer that is formed at least on the inner wall face of the above-mentioned opening section, and that includes at least one type of nitrides or carbides of Ti, Zr, Hf, V, Nb, Ta, or Si; and a plating film formed within the above-mentioned opening section. The printed circuit board is also characterized in having the above-mentioned plating film and the above-mentioned first conductor circuit in direct contact at a minimum of one section.</p> |
