SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

Disclosed is a semiconductor device wherein flash is suppressed when reflow soldering is performed, stability of a semiconductor element connecting interface is ensured, and connection reliability with respect to thermal stress is improved. The semiconductor device is provided with: a semiconductor element (1) having an Ni electrode (14); an Ni-plated frame; an Sn-Bi-Cu lead-free solder (3) which connects the Ni electrode (14) of the semiconductor element (1) to the Ni-plated frame; and a resin which seals the periphery of the semiconductor element (1).