| 摘要 |
<p>PURPOSE: A semiconductor package is provided to greatly reduce the size of semiconductor package by forming the semiconductor package on the film having thin thickness. CONSTITUTION: A film(100) comprises a film body, a hard coating layer(120), a bond finger(130), and a via electrode(140). The film body is in the shape of a thin film having very thin thickness. A semiconductor chip(200) is attached on the hard coating layer with the adhesive member(201). The semiconductor chip comprises a bonding pad(210) electrically connected to a circuit part.</p> |
