PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE INKJET INK, PHOTOSENSITIVE ADHESIVE, PHOTOSENSITIVE COATING AGENT, AND SEMICONDUCTOR SEALING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having an excellent photocurable property (surface curing property and inside curing property) that curing is not suppressed by humidity and a high storage stability of which the cured product has a mechanical characteristic being excellent in toughness and flexibility and has an excellent film physical property in which a high adhesion property and suppression of curling of a base material are further made compatible.SOLUTION: The photosensitive resin composition includes 5-80 mass% of compound (a) represented by formula (1) (wherein Rrepresents 1-5C alkyl, 5-10C cycloalkyl, 1-5C alkoxy, halogen, hydroxyl, aryl or aralkyl; m1 represents an integer of 2-5; and nrepresents an integer of 0-20), 1-40 mass% of a branched compound (b) having two or more of hydroxyl groups in one molecule and having a weight-average molecular weight of 1,000 or more and 5-90 mass% of a reactive organic silicone compound (c).