| 摘要 |
PURPOSE: A method for manufacturing camera module using laminated film is provided to electrically connect image sensor and PCB using conductive material, thereby reducing manufacturing time by eliminating wire bonding process. CONSTITUTION: An image sensor(120) is combined to the printed circuit board(121) through a coupling groove(127). A laminated film(125) is attached to an upper part of the printed circuit board and the image sensor. The laminated film includes the conductive material(125-3) in the peripheral unit of the window. The window at the central part of the laminated film transmits light. An infrared ray filter coating layer(125-1) is formed in the upper side of the window. The image sensor and the printed circuit board are electrically connected by the conductive material. |
