| 摘要 |
PURPOSE: A semiconductor package is provided to reduce manufacturing processes of a semiconductor package by performing processes for redistribution and a pillar-shaped connection member by a printing method. CONSTITUTION: A semiconductor package(100) includes: a substrate(10) in which a connection pad(5) is formed; a semiconductor chip(20) including a bonding pad(24) facing the connection pad; and a conductive connect member(30) which electrically connects the bonding pad and the connection pad and includes a binder fixing conductive fillers.
|
