| 摘要 |
PROBLEM TO BE SOLVED: To provide a hollow sealing type semiconductor device of a face-up structure which is inexpensive, light, and thin, as compared to the case where a semiconductor process and a material are used.SOLUTION: In a semiconductor package which draws a conductive wiring pattern 18 around from the side of a backside of an IC chip 14 to the side of a surface (light receiving surface/active surface), a thermoplastic resin or thermosetting resin is used as a backside sealing material. A hollow sealing type semiconductor device 10 of a face-up structure is made by sealing the IC chip 14, which is mounted on a glass substrate 11, in a hollow body with a resin substrate 17 which is the backside sealing material. The resin substrate 17 has the patterned conductive wiring pattern 18. Electrical connection between the conductive wiring pattern 18 and the side of the glass substrate 11 is made through a conductive paste 20 with which a via hole 19 is filled. |
