发明名称 CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE FOR CIRCUIT MEMBER USING THE SAME, AND METHOD FOR PRODUCTION THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a circuit connecting material that has excellent connection reliability and connection appearance by inhibiting peeling on interfaces of circuit members and a circuit connecting part, while maintaining good conductivity between opposite electrodes and good adhesive strength between the opposite circuit members.SOLUTION: The circuit connecting material which includes a first circuit member 20 having a plurality of first circuit electrodes 22 formed on a principal surface 21a of a first circuit board 21 and a second circuit member 30 having a plurality of second circuit electrodes 32 formed on a principal surface 31a of a second circuit board 31 is a circuit connecting material for electrically connecting the first circuit electrodes 22 and the second circuit electrodes 32 in such a state that the first circuit electrodes 22 and the second circuit electrodes 32 face each other. The circuit connecting material contains an adhesive composition 40, conductive particles 53, and insulating particles 51 containing one or both of polyamic-acid particles and polyimide particles, and an average particle size of the insulating particles 51 is 5 to 10 μm.
申请公布号 JP2011003924(A) 申请公布日期 2011.01.06
申请号 JP20100202171 申请日期 2010.09.09
申请人 HITACHI CHEM CO LTD 发明人 TATEZAWA TAKASHI;KOBAYASHI KOJI;FUKUSHIMA NAOKI;KOBAYASHI TAKANOBU;ITO AKIHIRO
分类号 H01L21/60;C09J9/02;C09J11/04;C09J11/08;C09J201/00;H05K3/32 主分类号 H01L21/60
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