| 摘要 |
PROBLEM TO BE SOLVED: To achieve a highly reliable electronic component.SOLUTION: An electronic component includes an element 3, external connection terminals 11, 12 electrically connected to the element 3, and an outer case 4 covering the element 3 so as to expose the external connection terminals 11, 12, wherein the outer case 4 contains an inorganic filler and is molded so that a remaining norbornene-based monomer is ≤10,000 wt.ppm. With this configuration, the electronic component 1 can prevent the generation of a gas from the outer case 4 in a solder reflow process and improve reliability thereof. |
