发明名称 TEST DEVICE OF SEMICONDUCTOR INTEGRATED CIRCUIT, TEST METHOD, AND SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a test device for testing a semiconductor integrated circuit in a short time without applying excessive stress.SOLUTION: The test device 1 of the semiconductor integrated circuit 10 testing the semiconductor integrated circuit 10 by applying a voltage to a semiconductor element of the semiconductor integrated circuit 10 includes a voltage application part 2, a breakdown detection part 3, and a test voltage determination part 4. The voltage application part applies the voltage previously determined on a breakdown measurement circuit element 11 provided in the semiconductor integrated circuit and for measuring a test voltage applied to the semiconductor element. The breakdown detection part 3 detects the breakdown of the breakdown measurement circuit element 11 and the test voltage determination part 4 determines the voltage as the test voltage.
申请公布号 JP2011002411(A) 申请公布日期 2011.01.06
申请号 JP20090147494 申请日期 2009.06.22
申请人 SHARP CORP 发明人 MATSUMOTO TAKASHI;NAKAMURA HITOSHI;FURUKABU TOSHIAKI;ENDO SUEO;OTSUKA KAZUHIRO;UEDA EIICHI
分类号 G01R31/28;G01R31/26 主分类号 G01R31/28
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