发明名称 |
TEST DEVICE OF SEMICONDUCTOR INTEGRATED CIRCUIT, TEST METHOD, AND SEMICONDUCTOR INTEGRATED CIRCUIT |
摘要 |
PROBLEM TO BE SOLVED: To provide a test device for testing a semiconductor integrated circuit in a short time without applying excessive stress.SOLUTION: The test device 1 of the semiconductor integrated circuit 10 testing the semiconductor integrated circuit 10 by applying a voltage to a semiconductor element of the semiconductor integrated circuit 10 includes a voltage application part 2, a breakdown detection part 3, and a test voltage determination part 4. The voltage application part applies the voltage previously determined on a breakdown measurement circuit element 11 provided in the semiconductor integrated circuit and for measuring a test voltage applied to the semiconductor element. The breakdown detection part 3 detects the breakdown of the breakdown measurement circuit element 11 and the test voltage determination part 4 determines the voltage as the test voltage. |
申请公布号 |
JP2011002411(A) |
申请公布日期 |
2011.01.06 |
申请号 |
JP20090147494 |
申请日期 |
2009.06.22 |
申请人 |
SHARP CORP |
发明人 |
MATSUMOTO TAKASHI;NAKAMURA HITOSHI;FURUKABU TOSHIAKI;ENDO SUEO;OTSUKA KAZUHIRO;UEDA EIICHI |
分类号 |
G01R31/28;G01R31/26 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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