| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a silicon microphone module and an MEMS chip are reduced in size, thereby reducing the volume capacity of a back air chamber as well as reducing sensitivity and S/N ratio.SOLUTION: An MEMS device includes a first cavity part, a second cavity part, and a gap part connecting the first and second cavity parts, which are formed on a substrate, and an MEMS element is formed just above the first and second cavity parts. Since a space formed by connecting two cavity parts through the gap part functions as a back air chamber of the MEMS element, the volume of the back air chamber can be made larger than that of a conventional back air chamber formed by one cavity part, so that the sensitivity and S/N ratio of the MEMS element can be improved. |
