| 摘要 |
PURPOSE: A semiconductor package manufacturing method is provided to improve the yield rate by simplifying the forming process of a rewiring. CONSTITUTION: A bonding pad(112) is formed on the upper side of a semiconductor chip(100). The epoxy resin layer including the conductive particle(135) is formed on the top of the semiconductor chip. A mask is arranged on the top with the distance from the semiconductor chip. A metal pattern is formed on a surface opposing the semiconductor chip. |
