| 摘要 |
<p>Disclosed is a copper foil for printed wiring boards, which has both excellent adhesion to an insulating substrate and excellent etching properties, is suitable for the formation of fine pitch, and can be produced at low cost. The copper foil for printed wiring boards comprises a copper foil base material and a coating layer that covers at least a part of the surface of the copper foil base material, wherein the coating layer comprises a Ni-Sn alloy layer containing Ni and Sn and a Cr layer laminated in this order as observed from the surface of the copper foil base material, the Cr layer contains Cr in an amount of 18 to 180 µg/dm2, and the Ni-Sn alloy layer contains Ni and Sn in the total amount of 18 to 450 µg/dm2.</p> |
