SIMPLIFIED COPPER-COPPER ADHERING METHOD

摘要

The invention relates to a method for adhering a first copper element to a second copper element, comprising a step of forming a crystalline layer of oxygen-enriched copper on each of the surfaces of each of the first and second elements, by means of which the elements will be in contact, the total thickness of the two layers being less than 6 nm, said step including: a) at least one step of polishing the surfaces so as to obtain a roughness of less than 1 nm RMS and hydrophilic surfaces; b) at least one step of cleaning said surfaces in order to remove any particles from the polishing process and the majority of corrosion inhibitors; and c) a step of contacting the two crystalline layers of oxygen-enriched copper.