SHORT CIRCUIT PROTECTION DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a short circuit protection device that enables the avoidance of increase in the size of an inverter and the cost thereof.SOLUTION: A first metal 22 is provided between a semiconductor device 20 and an electrode 21 connected to the semiconductor device 20. A second metal 24 different from the first metal 22 is provided between a first terminal 17 and a second terminal 18 at a terminal connection 19 of a power module. The melting point of the first metal 22 is higher than the melting point of the second metal 24 provided between the terminals 17, 18. A eutectic metal whose melting point is lower than that of the first metal 22 is used for the second metal 24.