发明名称 METHOD OF MANUFACTURING THIN-PIECE ELEMENT ARRAYED SUBSTRATE, AND THERMOELECTRIC CONVERSION MODULE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a thin-piece element arrayed substrate, which is high in productivity and in which thin-piece elements are arranged in a single layer on a substrate, with high density.SOLUTION: The method of manufacturing the thin-piece element arrayed substrate, in which the thin-piece elements are arranged in the single layer on the substrate, includes a process of carrying the thin-piece elements with an inclined flow of liquid using element carrying liquid, a process of integrating the thin-piece elements, and a process of arraying the integrated thin-piece elements on the substrate.
申请公布号 JP2011003579(A) 申请公布日期 2011.01.06
申请号 JP20090143147 申请日期 2009.06.16
申请人 KONICA MINOLTA HOLDINGS INC 发明人 SUZUKI SHINICHI;ANDO HIROAKI
分类号 H01L35/34 主分类号 H01L35/34
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