发明名称 METHOD OF DESIGNING A PRINTED CIRCUIT BOARD, AND PACKAGE TEST DEVICE HAVING THE PRINTED CIRCUIT BOARD
摘要 In a method of designing a printed circuit board, a package capacitance, a package inductance, and a chip capacitance of an actual memory device are calculated. A signal line capacitance and a signal line inductance per unit length of a signal line are calculated based on characteristics of the printed circuit board. A length of the signal line for each pin is determined based on the package capacitance and the signal line capacitance.
申请公布号 US2011004861(A1) 申请公布日期 2011.01.06
申请号 US20100829921 申请日期 2010.07.02
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JEONG JAE-HOON;KO CHANG-WOO;SONG KI-JAE;SEO HUN-KYO
分类号 G01R31/26;G06F17/50 主分类号 G01R31/26
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