发明名称 |
LASER BEAM MACHINING METHOD AND LASER BEAM MACHINING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a laser beam machining method and a laser beam machining apparatus capable of executing the fine machining on a surface and an inner side of a workpiece through which the beams in both regions of the terahertz region and the visible light region are transmitted in a short time and with high efficiency.SOLUTION: The laser beam machining method includes: a laser beam applying step of forming a modified area 50 with the physical properties being modified by forming a superimposed focal spot to the laser beam L, superimposing the focal point on a workpiece 5 through which the laser beam L is transmitted and applying the laser beam L thereto; and an etching step of removing the modified area 50. |
申请公布号 |
JP2011000631(A) |
申请公布日期 |
2011.01.06 |
申请号 |
JP20090147337 |
申请日期 |
2009.06.22 |
申请人 |
SEIKO EPSON CORP |
发明人 |
AMAKO ATSUSHI;YOSHIMURA KAZUTO |
分类号 |
B23K26/36;B23K26/00;B23K26/06 |
主分类号 |
B23K26/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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