发明名称 LASER BEAM MACHINING METHOD AND LASER BEAM MACHINING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a laser beam machining method and a laser beam machining apparatus capable of executing the fine machining on a surface and an inner side of a workpiece through which the beams in both regions of the terahertz region and the visible light region are transmitted in a short time and with high efficiency.SOLUTION: The laser beam machining method includes: a laser beam applying step of forming a modified area 50 with the physical properties being modified by forming a superimposed focal spot to the laser beam L, superimposing the focal point on a workpiece 5 through which the laser beam L is transmitted and applying the laser beam L thereto; and an etching step of removing the modified area 50.
申请公布号 JP2011000631(A) 申请公布日期 2011.01.06
申请号 JP20090147337 申请日期 2009.06.22
申请人 SEIKO EPSON CORP 发明人 AMAKO ATSUSHI;YOSHIMURA KAZUTO
分类号 B23K26/36;B23K26/00;B23K26/06 主分类号 B23K26/36
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