RESIN COMPOSITION, RESIN-CONTAINING CARRIER MATERIAL, MULTI-LAYERED PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

摘要

There is disclosed a resin composition used for forming a resin layer in a sheet-formed carrier material with a resin, comprising a poly-functional epoxy resin (a) having three or more glycidyl ether groups with an epoxy equivalent of 100 to 300, a compound (b) having one or more carboxyl groups with a melting point of equal to or more than 50 degrees C and equal to or less than 230 degrees C, and a curing agent (c).