| 摘要 |
PURPOSE: A method for manufacturing a semiconductor package is provided to improve the reliability of a joint part by firmly connecting a connection member to a circuit pattern. CONSTITUTION: A connection member(120) is formed on a bonding pad. The semiconductor chip is attached to a core layer(110) with a face-up type. A resin layer(160) is formed on the core layer including the semiconductor chip to have the thickness to expose the connection member. A metal layer connected to the exposed connection member is formed on the surface of the resin layer. The resin layer is comprised of prepreg including epoxy resin and glass fiber. |
