| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum processing apparatus mounting a plurality of substrates on the electrostatic chuck without intervening a tray between the electrostatic chuck and the substrates.SOLUTION: This electrostatic chuck 10 includes a plurality of chuck regions 16 (16A-16E) on the upper surface of a chuck plate 13. The chuck regions 16 are formed on the upper surfaces of a plurality of island-like portions 17 formed to protrude from the upper surface of the chuck plate 13, respectively. Bipolar electrode layers 20a, 20b for adsorbing a substrate and outflow holes 18 for a substrate cooling gas are provided in the inside of each of the island-like portions 17, respectively. This configuration eliminates the necessity of operation for attaching a cover to the upper surface of a tray in which a plurality of substrates are placed to hold the substrates in the tray, and workability and productivity are improved. Cooling efficiency of substrates is also improved. |
