Disclosed is a light-emitting diode package, comprising: a package body having a cavity; a light-emitting diode chip having a plurality of light-emitting cells connected in serial with each other; a fluorescent body for converting the wavelength of light emitted by the light-emitting diode chip; and a pair of lead electrodes. The light-emitting cells are connected together in series between the pair of lead electrodes.
申请公布号
WO2011002208(A2)
申请公布日期
2011.01.06
申请号
WO2010KR04222
申请日期
2010.06.30
申请人
SEOUL SEMICONDUCTOR CO., LTD.;JUNG, JUNG HWA;OH, HEE TAK;KIM, DO HYUNG;KWON, YOU JIN;KIM, OH SUG
发明人
JUNG, JUNG HWA;OH, HEE TAK;KIM, DO HYUNG;KWON, YOU JIN;KIM, OH SUG