| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition with a high dielectric constant that has a high dielectric constant and a low dielectric dissipation factor and exhibits excellent resin-filling properties for a circuit part to be suitable for application for an insulating layer between circuits, and can be molded by a general press machine serviceable at 200°C or lower, a resin sheet with a high dielectric constant and a copper foil with the resin with a high dielectric constant.SOLUTION: The resin composition with a high dielectric constant comprises 100 pts.mass of a mixed resin (A) comprising a thermosetting polyphenylene ether having a number-average molecular weight of 500-3,000 with a styrene-modified end and a styrene elastomer in a mass mixing ratio of the thermosetting polyphenylene ether to the styrene elastomer of 60:40 to 80:20 and, incorporated therewith, 250-900 pts.mass of an inorganic insulating filler with a high dielectric constant having an average particle size D50 of at least 0.7 μm and a maximum particle size of at most 10 μm, and has a dielectric constant of at least 10 and a dielectric dissipation factor of less than 0.01 at room temperature as measured at a frequency of 1 GHz. |
