MICROSTRUCTURE INSPECTION METHOD, MICROSTRUCTURE INSPECTION APPARATUS, AND MICROSTRUCTURE INSPECTION PROGRAM

摘要

A microstructure inspection method which inspects an angle of a sidewall of a sample microstructure pattern, the method including: taking SEM photographs of the sample microstructure pattern under plural SEM conditions; measuring a width of a white band at an edge portion of the sample microstructure pattern in the SEM photographs; and calculating the angle of the sidewall of the sample microstructure pattern on the basis of an amount of change in the width of the white band due to the change between the plural SEM conditions.