摘要 |
An evaporation apparatus for coating a substrate having an evaporation structure for evaporating material, the evaporation structure having an evaporation structure surface for receiving a wire; a wire feed for providing the wire; and a bending fixture with the bending fixture including a first and a second roller for giving the wire a reproducible curvature so that in operation of the evaporation apparatus the contact spot of the wire on the evaporation structure is at a desired position.
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