PROTECTION TAPE FOR PLATING

摘要

Disclosed is a protection tape for plating, which is capable of preventing occurrence of plating failure and can be easily removed after being used. Specifically disclosed is a protection tape for plating, which is used for the purpose of protecting a surface that is not to be plated during plating by an electroless plating method or an electrolytic plating method. The protection tape for plating is composed of a base and an adhesive layer that is formed on at least one surface of the base and contains a photocurable adhesive and a photopolymerization initiator. When the molecular weight of the photopolymerization initiator is represented by x and the blending amount of the photopolymerization initiator per 100 parts by weight of the photocurable adhesive in the adhesive layer is represented by y (parts by weight), x and y are within the range indicated by the broken line in fig. 1.