METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP, AND SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To aim at gaining both of suppression of a decrease in dicing properties and that of an increase of chipping of semiconductor wafers in dicing.SOLUTION: In the semiconductor wafer 1, a plurality of wiring layers are formed, a plurality of chip constitution sections 2 that become semiconductor chips including a portion of the plurality of respective wiring layers are formed, and the mutually adjacent chip constitution sections 2 are connected mutually and electrically via connection wiring 3 included in any one of the wiring layers. A dummy metal pattern 6 made of a plurality of dummy metals 5 is formed only at an arrangement region of the connection wiring 3 or within a range corresponding to an area near the arrangement region thereof in at least one wiring layer of the upper and lower layers of the connection wiring 3 among the plurality of wiring layers. The chip constitution sections 2 are mutually separated to form a semiconductor chip by cutting the semiconductor wafer 1 along a scribe line 4 extended to cross the connection wiring 3 between the mutually adjacent chip constitution sections 2.