| 摘要 |
PROBLEM TO BE SOLVED: To achieve an electronic unit having higher productivity.SOLUTION: The electronic unit has: a substrate 110 mounted with electronic components; a lead frame 100 for fixing the substrate; each spot nickel plating part 400 provided in the lead frame; each wire 120 electrically connecting between the substrate and the lead frame; and a resin 130 for sealing the substrate and a part of the lead frame. The spot nickel plating part 400 comprises: a first plating layer 410 having a prescribed crystal grain size; and a second plating layer 415 provided so as to cover the first plating layer 410 and having a crystal grain size smaller than that of the first plating layer 410. |
