METHOD AND DEVICE FOR CUTTING SINGLE CRYSTAL

摘要

PROBLEM TO BE SOLVED: To provide a method and a device for cutting a single crystal that can accurately cut the single crystal and enhance the wafer yield during the cutting.SOLUTION: The method for cutting the single crystal includes steps of: measuring the angle between a crystal surface of the single crystal and an external surface by a device 10 outside a cutting machine; measuring the orientation of the external surface 2 by the cutting machine after measuring the angle by using an autocollimation telescope 25; positioning the single crystal based upon the orientation of the external surface such that a predetermined crystal surface is at a predetermined angle to a feed direction; and cutting the single crystal. The step of measuring the angle between the crystal surface and external surface includes steps of: measuring the angle of the external surface to a reference axis by the autocollimation telescope 14; measuring the angle of the external surface to the reference axis by an X-ray goniometer; and subtracting the measured angles from each other so as to obtain a correction value, wherein the step of positioning the single crystal includes a step of positioning the single crystal based upon the measured orientation of the external surface and the obtained correction value using an orientation adjusting device 24.