| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper polyimide laminated film for improving normal adhesive power, heat-resistant adhesive power after the application of a heat load to the film, and furthermore, the adhesive power of the film subjected to electroless tin plating, and heat load application after thin line patterning in a view of the fact that the adhesive power used is insufficient as far as the copper polyimide laminated film manufactured using a conventional technique is concerned.SOLUTION: The copper polyimide laminated film is constituted of a seed layer composed of a nickel/chromium alloy and a copper thin film layer formed on a polyimide film in this order by a sputtering method. In addition, a copper layer is laminated on layers by plating method. The thickness of the polyimide film is 37 to 39 μm and the L value is 75 to 85. Besides, adhesive power T1 between the copper layer and the polyimide film in a normal state is 5.5 to 6.5 N/cm in terms of the copper layer thickness of 8 μm. |
