发明名称 ULTRASONIC BONDING APPARATUS AND ULTRASONIC BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an ultrasonic bonding apparatus and an ultrasonic bonding method preventing deformation of a workpiece attributable to ultrasonic bonding.SOLUTION: The ultrasonic bonding apparatus 100 holds a first plate-like workpiece 30 and a second plate-like workpiece 12 between a horn 110 and an anvil 120, pressurizes the workpieces and imparts the ultrasonic vibration to them to thereby bond the first workpiece and the second workpiece. The second workpiece is softer than the first workpiece. The ultrasonic bonding apparatus has a pressing unit 150 for pressing the floating 17 of the second workpiece after the ultrasonic vibration is stopped, and also has a folding unit 160 which folds an end 15 of the second workpiece projecting from an end of the first workpiece after the pressing unit presses the raise. The folding unit folds the end of the second workpiece so as to hold the end of the first workpiece.
申请公布号 JP2011000611(A) 申请公布日期 2011.01.06
申请号 JP20090145551 申请日期 2009.06.18
申请人 NISSAN MOTOR CO LTD 发明人 TANAKA TOSHIHARU
分类号 B23K20/10;B23K20/26 主分类号 B23K20/10
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