SEMICONDUCTOR CHIP, STACK MODULE, MEMORY CARD, AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: A semiconductor chip, a stack module, a memory card, and a manufacturing method thereof are provided to prevent the electrical resistance increase of an electrode by arranging a burying part which has a uniform width. CONSTITUTION: A substrate(105) comprises a first and a second side. A via electrode(150) is arranged in order to bury at least one via hole(135). The via electrode is extended from the first side of the substrate. The via electrode comprises a first burying part(152), a second burying part(154), and/or a protrusion part(156). The via hole comprises a first part(126) and a second part(132). The via hole is vertically extended from the first side of the substrate and the second side.