发明名称 METHOD OF ULTRAVIOLET EXPOSURE, ULTRAVIOLET EXPOSURE DEVICE, AND METHOD FOR MANUFACTURING ELECTROFORMING MOLD PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a method of ultraviolet exposure capable of imparting an inclined plane to the sidewall of a resist pattern at an optional angle to a micronano pattern which is difficult to form an inclination on the sidewall, and to provide an ultraviolet exposure device.SOLUTION: A method of ultraviolet exposure includes: a step of exposing an ultraviolet photosensitive material to a pattern of a photomask by changing the relative position of the focal point of the ultraviolet ray and the ultraviolet photosensitive material that is formed on the substrate; and a step of developing the ultraviolet photosensitive material. In the method of ultraviolet exposure and the ultraviolet exposure device, the pattern of the ultraviolet photosensitive material having the inclined plane according to the relative position is formed at the sidewall.
申请公布号 JP2011003831(A) 申请公布日期 2011.01.06
申请号 JP20090147519 申请日期 2009.06.22
申请人 NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE & TECHNOLOGY 发明人 MEIKARI HARUTAKA;KOIZUMI OSAMU;UENO AKIHISA;TAKAHASHI MASAHARU
分类号 H01L21/027;B29C33/38;G03F7/20;G03F9/00 主分类号 H01L21/027
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