| 摘要 |
PURPOSE: A semiconductor package is provided to improve electrical reliability by bonding a top semiconductor chip with a substrate. CONSTITUTION: A bond finger(112) is formed on the upper surface of a substrate and includes a ball land on the bottom. The first semiconductor chip is attached to one side of the substrate with a face-down type through a first adhesive member. A second semiconductor chip is arranged with a face-down type to be connected to the bond finger of the substrate. A dummy member(120) is attached to one side of the second semiconductor chip. An external connection terminal(144) is attached to the bottom of the first semiconductor chip and the substrate. |
