发明名称 WET TREATMENT DEVICE AND WET TREATMENT METHOD
摘要 <p>A wet treatment device retains a substrate to be treated on a stage and rotates the stage, to perform a wet treatment. The substrate to be treated, the center of which is moved away from the rotation center of the stage, is retained in the stage using a Verneuil chuck which blows an inert gas onto the reverse side of the substrate to be treated, so that the substrate to be treated rotates eccentrically in conjunction with the rotation of the stage. A first gas supply route used for the Verneuil chuck is provided in a rotary shaft portion within the stage. Further, in the stage, second gas supply routes which communicate with the first gas supply route to introduce an inert gas onto the reverse side of the substrate to be treated are axisymmetrically placed with respect to the center axis of the substrate to be treated.</p>
申请公布号 WO2011001767(A1) 申请公布日期 2011.01.06
申请号 WO2010JP58993 申请日期 2010.05.27
申请人 TOHOKU UNIVERSITY;TOKYO ELECTRON LIMITED;OHMI, TADAHIRO;GOTO, TETSUYA;MATSUOKA, TAKAAKI;NEMOTO, TAKENAO;MURAKAWA, YORIYUKI;YOSHIKAWA, KAZUHIRO 发明人 OHMI, TADAHIRO;GOTO, TETSUYA;MATSUOKA, TAKAAKI;NEMOTO, TAKENAO;MURAKAWA, YORIYUKI;YOSHIKAWA, KAZUHIRO
分类号 H01L21/306;H01L21/304 主分类号 H01L21/306
代理机构 代理人
主权项
地址