| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor wafer, capable of inhibiting adverse effects on a semiconductor and presenting difficulties in acquiring the semiconductor wafer and for simplifying a manufacturing apparatus, and to provide an apparatus therefor.SOLUTION: The semiconductor wafer 1 is mounted on a rotating stage 11, and a chamfered part 2 at its corner is brought close to a rotation shaft 14 of the rotating stage 11; an X-direction moving stage 15 is moved to locate an optical axis 27 of a condenser lens 23 toward a circumference of a surface of the semiconductor wafer 1; a laser irradiation device 20 is adjusted so that a convergent point can be formed within the semiconductor wafer; the rotating stage 11 is rotated to make a linear velocity of the convergent point constant, and also a laser beam 21 is irradiated; and the X-direction moving stage 15 is moved, and the laser beam 21 is moved from the circumference of the surface of the semiconductor wafer 1 toward the chamfered part 2, each time the rotating stage 11 rotates by a predetermined angle. Thereafter, laser irradiation is stopped to form an intermediate product when the rotation shaft 14 and the optical axis 27 of the condenser lens 23 reach a predetermined distance. |
