发明名称 METHOD FOR FORMING PATTERN FOR TRANSPARENT CONDUCTIVE LAYER
摘要 Provided is a low cost method for easily forming a pattern on a transparent conductive layer that has a low electrical resistance, a high transparency, and is highly invisible to the eye. The method for forming a pattern on a transparent conductive layer comprises the following steps: a step (1) for releasably forming a transparent conductive layer on a substrate; a step (2) for forming a negative-patterned heat-sensitive adhesive layer on a support body; a step (3) for attaching the substrate and the support body in such a manner that the transparent conductive layer and the heat-sensitive adhesive layer adhere to each other; a step (4) for forming a pattern for the transparent conductive layer on the substrate by removing the support body from the substrate and by transferring the portions of the transparent conductive layer that adhered to the heat-sensitive adhesive layer onto the heat-sensitive adhesive layer; and a step (5) for fixing the transparent conductive layer on the substrate by applying a coating for forming a protective layer on the entire substrate formed with the aforementioned pattern for the transparent conductive layer and thereby impregnating the transparent conductive layer with said coating.
申请公布号 WO2011001961(A1) 申请公布日期 2011.01.06
申请号 WO2010JP61026 申请日期 2010.06.29
申请人 DIC CORPORATION;YAMAZAKI YOSHIKAZU;HAYAKAWA SATOSHI;MIYAMOTO MASASHI 发明人 YAMAZAKI YOSHIKAZU;HAYAKAWA SATOSHI;MIYAMOTO MASASHI
分类号 H01B13/00;G06F3/041 主分类号 H01B13/00
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