| 摘要 |
<p>PURPOSE: A semiconductor package is provided to improve the performance of the semiconductor package better by storing and processing the data using a light receiving sensor receiving the light and a driving module refracting the light. CONSTITUTION: A substrate(10) comprises a substrate body(1), a connection pad(3), a voland(5), and a connection member(7). A first optical element(20) is electrically connected to a connection pad formed on the substrate body. A reflection block(30) is arranged on the upper side of the substrate body.</p> |
